Download PDF by Roy Leventhal, Lynne Green, D.J. Carpenter: Semiconductor modeling for simulating signal, power, and

By Roy Leventhal, Lynne Green, D.J. Carpenter

ISBN-10: 0387241590

ISBN-13: 9780387241593

Semiconductor Modeling: For Simulating sign, energy, and Electromagnetic Integrity assists engineers – either fresh graduates and dealing product designers – in designing high-speed circuits. The authors observe circuit idea, circuit simulation instruments, and sensible event to assist the engineer comprehend semiconductor modeling as utilized to high-speed electronic designs. The emphasis is on semiconductor modeling, with PCB transmission line results, gear enclosure results, and different modeling matters mentioned as wanted. The textual content addresses many useful issues, together with method edition, version accuracy, validation and verification, sign integrity, and layout circulation. Readers will take advantage of its survey of modeling for semiconductors, applications, and interconnects, besides usable recommendation on find out how to get complicated, high-speed prototypes to paintings at the first try.

Highlights include:

- provides a really entire and well-balanced therapy of modeling of semiconductors, programs, and interconnects. allows reader comprehension of the complete box of high-speed modeling, together with electronic and RF circuits.

- Combines functional modeling options with the most recent EDA instruments for simulation and winning high-speed electronic layout. enables answer of functional, every-day problems.

- provides modeling from its historic roots to present state-of-the-art. enables holding abreast of the newest modeling advancements as they proceed to spread.

- features a CD-ROM with modeling software program and extra version examples.

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Extra info for Semiconductor modeling for simulating signal, power, and electromagnetic integrity

Example text

This is good in relation to the bulleted list above. But there are some cautions: • Switching currents, particularly di/dt, have increased especially as the numbers of gates in ICs have grown. This is to deliver more functions to the users. • Along with shrinking size and power levels, device fragility and sensitivity to signal noise have increased. This last bullet means that noise levels that could have been ignored in the past no longer can be. Switching threshold voltages have decreased along ^ Rule of thumb 2.

Before the physical product has been built, its variations can be modeled, simulated, and designed to meet requirements. 1 Modeling Limitations: Simplifications and Assumptions When we simplify a model, the result is often a gain in understanding and speed of analysis. This is because we first want to see the big picture. However, we must be careful to not use a simplified model beyond its range of definition and assumptions. Otherwise, we might run into trouble. We can get into trouble even faster when we assume that we understand a model when we really do not.

AHDL and RF modeling are covered for the sake of completeness and because of some convergence between microwave and serial Gbit and GHz design techniques. SPICE has one of the best reputations and largest 40 Chapter 2 foUowings of any of these modeling methods, but be aware that SPICE comes in many different flavors. To name a few: Berkeley SPICE, BSIM3, BSIM4, HSPICE, PSPICE, AIMSPICE, and EKV. Parameters are not interchangeable between models, or between simulators. For example, HSPICE Level 28 and Level 53 MOS models have different equations and different parameters.

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Semiconductor modeling for simulating signal, power, and electromagnetic integrity by Roy Leventhal, Lynne Green, D.J. Carpenter

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