By Anthony N. Laskovski
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The influence of molecular weight on some properties of chitosan and its solutions Depending on the intended use, specific polymeric or oligomeric forms of chitin/chitosan are required. For some medical and pharmaceutical applications LMWC and chitooligosaccharides (COS) are more suitable. , 2010). ). , 2009; Patel, 2006): everything serves a purpose to control drug release. , 2009). , 2007). , 2007). 8 kDa. 8 kDa. , 2010a). , 2009). , 2009). These authors concluded that MMWC microspheres have the best characteristics: the strongest mucoadhesive properties, as well as flowability and drug release in a controlled manner.
The main factors that allow the use of chitin and chitosan as drug delivery vehicles is their biodegradability and the fact that they can be easily metabolized by certain human enzymes, especially lysozyme (Muzzarelli, 1997). , 2004). The usual ones are: • tablets – prepared by coating - sodium diclofenac, pentoxyphylline, salicylic acid; • capsules – prepared by capsule shell - insulin, 5-aminosalicylic acid; • microspheres/microparticles -prepared by emulsion cross-linking – progesterone, aspirin, theophylline; • nanoparticles – prepared by ionic gelation – ricin, bovin serum albumin; • beads – prepared by coacervation/precipitation – riboflavin, adriamycin; • films – prepared by solution casting – trypsin, testosterone, beta-oestradiol; • gel – prepared by cross-linking – hydrocortisone acetate, caffeine, 5-fluorouracil.
Dong Y, Liu HZ, Xu L, Li G, Ma ZN, Han F, Yao HM, Sun YH, Li SM. A novel CHS/ALG bilayer composite membrane with sustained antimicrobial efficacy used as wound dressing. Chinese Chem Lett 2010; 21: 1011-1014. Draye JP, Delaey B, Van Den Voorde A, Van Den Bulcke A, De Reu B, Schacht E. In vitro and in vivo biocompatibility of dextran dialdehyde cross-linked gelatin hydrogel films. Biomaterials 1998; 19: 1677-1687. Han SS. Topical formulations of water-soluble chitin as a wound healing assistantevaluation on open wounds using a rabbit ear model.
Biomedical Engineering, Trends in Materials Science by Anthony N. Laskovski